this is information on a product in full production. august 2013 docid024627 rev 1 1/8 8 EMIF04-1K030F3 4-line ipad?, emi filter including esd protection datasheet ? production data figure 1. pin configuration (bump side) figure 2. functional schematic features ? 4-line emi symmetrical (i/o) low-pass filter ? high efficiency in esd suppression on input pins (iec 61000-4-2 level 4) ? very low pcb space consumption ? very thin package ? high efficiency in emi filtering ? high reliability offered by monolithic integration ? high reduction of parasitic elements through integration and wafer level packaging ? lead-free package complies with the following standards: ? iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) application where emi filtering in esd sensitive equipment is required: ? mobile phones and communication systems ? computers, printers and mcu boards description the EMIF04-1K030F3 chip is a highly integrated device designed to supp ress emi/rfi noise for interface line filtering. the EMIF04-1K030F3 is 4-line, ultra compact, high attenuation filter available in 0.4 mm pitch wlcsp package. additionally, this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 20 kv. tm : ipad is a trademark of stmicroelectronics. flip-chip package (9 bumps) a b c 3 21 i3 i2 i1 i4 gnd o1 o2 o3 o4 15pf ix ox r = 1k 15pf www.st.com
characteristics EMIF04-1K030F3 2/8 docid024627 rev 1 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4: air discharge contact discharge 30 20 kv t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to +150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit i rm v rm = 5 v per line 300 na v br i r = 1 ma 6 v r i/o 1k ? c line v line = 0 v, v osc = 30 mv, f = 1 mhz 24 30 pf symbol p arameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i c line r i/o = = p = line capacitance eak pulse current br rm rm rm cl pp v cl pp series resistance between input and ouptput
docid024627 rev 1 3/8 EMIF04-1K030F3 characteristics figure 4. attenuation versus frequency figure 5. analog crosstalk versus frequency s21(db) 300k 1m 3m 10m 30m 100m 300m 1g 3g -60 -55 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 i1-o1 i2-o2 i3-o3 i4-o4 f(hz) 300k 1m 3m 10m 30m 100m 300m 1g 3g -70 -60 -50 -40 -30 -20 -10 0 i1-o2 i1-o4 crosstalk (db) f(hz) figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 34.5 v 5.5 v 5.4 v 250 mv 1 2 4 3 10.0 v / div v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 20 ns / div 10.0 v / div -30.6 v -6.7 v -6.6 v -108 mv 1 2 4 3 20 ns / div v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 figure 8. digital crosstalk figure 9. clamping voltage versuspeak pulse current (typical values) 20 ns / div 1.0 v / div t r = t f = 1.73 ns 0 5 10 15 20 25 0 5 10 15 positive polarity negative polarity i pp (a) v cl (v) t p = 100 ns
characteristics EMIF04-1K030F3 4/8 docid024627 rev 1 figure 10. step response measurement
docid024627 rev 1 5/8 EMIF04-1K030F3 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. flip-chip package dimensions figure 12. footprint recommendations figure 13. marking 255 40 m 400 40 m 1170 40 m 650 60 m 1170 40 m 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade
package information EMIF04-1K030F3 6/8 docid024627 rev 1 figure 14. tape and reel specification note: more information is availa ble in the application notes: an2348, ?ipad? 400 m flip chip: packag e description and recommendations for use? an1751, ?emi filters: recomm endations and measurements? dot identifying pin a1 location user direction of unreeling all dimensions are in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 + 0.3 / - 0.1 1.75 0.1 3.5 0.05 ? 1.50 0.1 0.69 0.05 1.24 0.05 0.20 0.02 1.24 0.05 st xxz yww st st xxz yww xxz yww
docid024627 rev 1 7/8 EMIF04-1K030F3 ordering information 3 ordering information figure 15. ordering information scheme 4 revision history table 3. ordering information order code marking package weight base qty delivery mode EMIF04-1K030F3 lc flip chip 1.72 mg 5000 tape and reel (7?) emif 04 - 1k0 30 f3 emi filter number of lines information 3 letters = application 2 digits = version package f = flip chip x = 3: lead-free, pitch = 400 m table 4. document revision history date revision changes 05-aug-2013 1 initial release
EMIF04-1K030F3 8/8 docid024627 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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